Preces informācija
Preces apraksts angļu valodā:
The Akasa High Performance thermal compound is a newly developed silicone paste which ensures a stable and reliable thermal performance. The reduced thermal resistance of 0.03 ° C-cm² / W @ 40 psi and the maximized thermal conductivity allow better cooling performance.
The paste can be processed excellently. Compared to the AK-460, the thermal behavior has been further improved. Due to the optimal consistency, the application is now even easier, also the particle size was further reduced, with the result that now even the last small gap between the CPU core and heat sink is closed evenly. The effect: low temperatures.
The application range is between - 45 ° C and 200 ° C degrees. The paste is electrically non-conductive.
Technical details:
The Akasa High Performance thermal compound is a newly developed silicone paste which ensures a stable and reliable thermal performance. The reduced thermal resistance of 0.03 ° C-cm² / W @ 40 psi and the maximized thermal conductivity allow better cooling performance.
The paste can be processed excellently. Compared to the AK-460, the thermal behavior has been further improved. Due to the optimal consistency, the application is now even easier, also the particle size was further reduced, with the result that now even the last small gap between the CPU core and heat sink is closed evenly. The effect: low temperatures.
The application range is between - 45 ° C and 200 ° C degrees. The paste is electrically non-conductive.
Technical details:
- Quantity: 3 grams
- Thermal resistance: 0.03 ° C-cm²C / W @ 40PSI
- Thermal conductivity: 2.9 W / mK
- Viscosity: 100 K cP
- Application range: - 45 ° C to 200 ° C
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